Electronics JTAG Module Design Spec - thepinkmile/Enigma-NG GitHub Wiki
JTAG Module (V1.0) Design Specification
Status: In Review Project: Enigma-NG Author: Izzyonstage & GitHub Copilot Version: v.0.1.0 Associated Hardware Revision: Rev A Last Updated: 2026-05-22
1. Overview
A high-speed USB-to-JTAG bridge module that allows the CM5 to natively program the 30-rotor CPLDs and the 6 I/O CPLDs and 1 Mapping CPLD. This module replicates the functionality of an Intel (Altera) USB Blaster II on a tiny daughterboard.
Functional & Design Requirements
Functional Requirements
| ID | Functional Requirement | Notes | Satisfied By / Cross-Ref |
|---|---|---|---|
| FR-JM-01 | Provide a USB-to-JTAG programming interface for all 37 CPLDs in the system | 1 Stator + 6 Encoder + 30 Rotor CPLDs | §2 Core Logic; BOM U1 (FT232H) |
| FR-JM-02 | Generate series-damped drive signals suitable for the controlled-impedance JTAG chain, and interface with the CM5 via USB 2.0 for JTAG programming software control | U2 buffers TCK/TMS; 33 Ω source termination at all JTAG outputs (R2/R3 after U2 buffer, R1 at FT232H TDI, R4 before J1 TDI pin); presented as FTDI JTAG device to OpenOCD via libftdi; no custom driver required | §3 Interface & Wiring; §6 Electrical Requirements; BOM J1 (DF40C-20 BtB connector), U1 (FT232H), U2, R1, R2, R3, R4 |
Design Requirements
| ID | Design Requirement | Specification | Satisfied By / Cross-Ref |
|---|---|---|---|
| DR-JM-01 | PCB stackup | Inverted stackup per design/Standards/Global_Routing_Spec.md §2.3.2 |
§5 PCB Fabrication & Stackup |
| DR-JM-02 | USB-to-JTAG bridge | FTDI FT232H (U1) in MPSSE mode | §2 Core Logic; BOM U1 (FT232HL LQFP-48) |
| DR-JM-03 | TDI series damping at FT232H | R1 = 33 Ω 0402 at FT232H TDI output | §6 Electrical Requirements; BOM R1 |
| DR-JM-04 | JTAG chain device count | 37 devices total (1 Stator CPLD + 6 Encoder CPLDs + 30 Rotor CPLDs) | §2 Core Logic; BOM U1 (FT232H) |
| DR-JM-05 | USB interface | USB 2.0 Full Speed via CM5 internal USB port; D+/D- route via J1 DF40C-20 BtB connector | §3 Interface & Wiring; BOM J1 (DF40C-20DP), Y1 (12MHz crystal) |
| DR-JM-06 | Power source | 5V_USB and 3V3_ENIG from Controller Board via J1 DF40C-20 BtB connector; FT232H self-powered USB mode | §6 Electrical Requirements |
| DR-JM-07 | Board-to-Board connector | J1 = Hirose DF40C-20DP-0.4V(51) 20-pin 0.4mm pitch BtB plug (bottom-centre of board; R1 on outer/bottom edge) | §3 Interface & Wiring; BOM J1 |
| DR-JM-08 | GND_CHASSIS exemption | M2.5 NPTH clearance holes. Electrical connection: GND (not GND_CHASSIS). Per DEC-057 daughterboard exception. | §3 Interface & Wiring |
| DR-JM-09 | Bulk cap exception | JM exempt from 5x bulk entry bank rule; C1-C4, C6-C9 = 8x 100nF per-IC decoupling (one per FT232H supply pin: VCCA, VCORE, VCCD, VCCIOx3, VPLL, VPHY) + C5 = 4.7µF 5V_USB entry filter. Bypass cap placement follows GRS §3.2 (within 1mm of IC Vcc pin, same layer). | §6 Electrical Requirements; BOM C1-C9; GRS §3; GRS §3.2 |
| DR-JM-10 | JTAG buffer | U2 = SN74LVC2G125DCUR (VSSOP-8) dual-channel buffer for TCK and TMS; placed between FT232H and J1 connector | §6 Electrical Requirements; BOM U2; DEC-024 |
| DR-JM-11 | TCK series damping after buffer | R2 = 33 Ω 0402 after U2 TCK output, before J1 pin C1R1 (TCK) | §6 Electrical Requirements; BOM R2; DEC-024 |
| DR-JM-12 | TMS series damping after buffer | R3 = 33 Ω 0402 after U2 TMS output, before J1 pin C2R2 (TMS) | §6 Electrical Requirements; BOM R3; DEC-024 |
| DR-JM-13 | TDI series damping before J1 | R4 = 33 Ω 0402 before J1 pin C10R1 (TDI) | §6 Electrical Requirements; BOM R4; DEC-024 |
| DR-JM-14 | TMS pull-up near J1 | R6 = 10 kΩ 0402 pull-up from TMS to 3V3_ENIG near J1 connector; idle-state TAP control | §6 Electrical Requirements; BOM R6 |
| DR-JM-15 | TCK pull-down near J1 | R7 = 10 kΩ 0402 pull-down from TCK to GND near J1 connector; idle-state TAP control | §6 Electrical Requirements; BOM R7 |
| DR-JM-16 | FT232H RESET_N pull-up | R5 = 10 kΩ 0402 pull-up from FT232H RESET_N (FT232H pin 34; IC datasheet designates this pin as RESET#; renamed RESET_N per project convention) to 3V3_ENIG; holds RESET_N deasserted (HIGH) during normal operation per FTDI application note AN_108; absence of pull-up risks chip latching in reset | §6 Electrical Requirements; BOM R5 |
| DR-JM-17 | JTAG buffer VCC bypass | C12 = 100nF X7R 0402 bypass capacitor shall be placed on the VCC supply of U2 (SN74LVC2G125DCUR) within 0.5mm of the VCC pin; 1OE and 2OE (active-low output enables) are permanently tied to GND, keeping both buffer channels always enabled | §6 Electrical Requirements; BOM C12 |
| DR-JM-18 | Mounting holes | JM mounting holes MH1–MH4 shall be NPTH M2.5 holes with a GND annular ring. Conductive standoffs connect to GND only (not GND_CHASSIS), per DEC-057 daughterboard exception. No purchasable BOM component — mounting hardware is owned by and specified in the Controller Board BOM (MH9–MH12, 9774035151R). See design/Standards/Global_Routing_Spec.md §4 for module mounting hole rules. |
§4 Aesthetics & Mounting; DEC-057; DEC-058 |
| DR-JM-19 | BtB connector placement and orientation | J1 (DF40C-20DP) shall be placed at bottom-centre of the JM board (positional keying — cannot accidentally mate with AM location on CTL). R1 of J1 shall be on the outer (bottom) edge. When mounted on the CTL, R1 shall face the LINK-BETA connector (J4/J5) to minimise JTAG trace lengths to the Stator. Orientation is enforced by the asymmetric MH1–MH4 pattern and silkscreen pin-1 markers (DF40 is mechanically polarity-free per Hirose Note 4). | §3 Interface & Wiring; §4 Aesthetics & Mounting; design/Standards/Global_Routing_Spec.md §7.1 |
| DR-JM-20 | No-component zone — underside | A minimum 1.0mm component-free zone shall be maintained on the underside (L4 face) of the JM, measured from the board outline. This ensures clearance above the CTL board when the JM is mounted as a hat. | §4 Aesthetics & Mounting; DEC-058 |
| DR-JM-21 | FT232H REF pin bias resistor | R8: 12 kΩ ±1% 0402 resistor from FT232H REF (pin 5) to GND. Sets the internal USB 2.0 High-Speed PHY bias reference current. Without R8, HS chirp negotiation fails and the device falls back to Full-Speed or fails to enumerate. Value and tolerance from FTDI FT232H datasheet §3.5 and Application Note AN_146. | §6 Electrical Requirements; BOM R8 (12kΩ, ERJ-2RKF1202X); FT232H datasheet §3.5, AN_146 |
| DR-JM-22 | FT232H TEST pin | FT232H TEST (pin 42) shall be tied directly to GND by a PCB copper trace. No series component. Floating TEST activates internal factory test mode and corrupts USB enumeration behaviour. Per FTDI FT232H datasheet Table 3.2. | §6 Electrical Requirements; FT232H datasheet Table 3.2 |
Component Block Diagram
flowchart TD
subgraph ctrlIface["Controller Interface"]
J1["J1: DF40C-20 BtB"]
end
subgraph bridge["USB-JTAG Bridge"]
U1["U1: FT232H (MPSSE)"]
Y1["Y1: 12 MHz Crystal"]
end
subgraph cond["JTAG Output Conditioning"]
U2["U2: SN74LVC2G125 Buffer"]
R1["R1: 33 ohm (TDI damp)"]
R2["R2: 33 ohm (TCK damp)"]
R3["R3: 33 ohm (TMS damp)"]
R4["R4: 33 ohm (TDI to J1)"]
end
subgraph bias["Idle-State Biasing"]
R5["R5: 10k (RESET_N pull-up)"]
R6["R6: 10k (TMS pull-up)"]
R7["R7: 10k (TCK pull-down)"]
end
J1 -- "5V_USB / 3V3_ENIG" --> U1
J1 -- "USB D+/D-" --> U1
U1 -- "TTD_RETURN" --> J1
U1 -- "TDI" --> R1
R1 --> R4
R4 -- "TDI" --> J1
U1 -- "TCK / TMS" --> U2
U2 --> R2
U2 --> R3
R2 -- "TCK" --> J1
R3 -- "TMS" --> J1
R5 --> U1
R6 --> J1
R7 --> J1
2. Core Logic
- Role: Converts the CM5's USB 2.0 signals into standard JTAG signalling (TCK, TMS, TDI, TDO) commands.
- Bridge IC: FT232H datasheet - High-Speed USB 2.0 to MPSSE.
- Function: Dedicated JTAG programmer for the global chain (30x Rotor CPLDs + 6x Encoder CPLDs + 1x Stator CPLD).
- Configuration: 12MHz crystal-controlled for stable JTAG programming via the CM5. See DEC-022.
- Software Stack:
ftdi_siokernel module for USB enumeration;OpenOCDwithlibftdifor JTAG/MPSSE operation (no custom driver required). CM5 enumerates the FT232H on Linux boot viaftdi_sio.
3. Interface & Wiring
J1 — DF40C-20 Board-to-Board Connector (20-Pin, 0.4mm Pitch)
- Type: Hirose DF40C-20DP-0.4V(51) — 20-pin 0.4mm pitch BtB plug
- Purpose: Single board-to-board interface providing system power (5V_USB + 3V3_ENIG from CTL), USB 2.0 data path to CM5 (D+/D-), and JTAG output signals (TCK, TMS, TDI, TDO) — all in one connector.
- Physical location: Bottom-centre of board; R1 on outer (bottom) edge; faces toward CTL LINK-BETA connector (J4/J5) when mounted.
- Mating Part (Controller J12): Hirose DF40HC(3.5)-20DS-0.4V(51) — 3.5mm stack height BtB receptacle. See
Controller/Design_Spec.md §8.3. - Stack height: 3.5mm (matching AM dock — same standoffs, 9774035151R, held in CTL BOM MH9–MH12).
- Polarity enforcement: The DF40 connector body is polarity-free (Note 4 in Hirose datasheet);
asymmetric placement of MH1–MH4 mounting holes (per DR-JM-18) is mandatory to enforce a single
valid mating orientation. A silkscreen pin-1 marker is required on both boards (per
design/Standards/Global_Routing_Spec.md §7.1).
J1 Pinout (20-pin DF40C)
C1 C2 C3 C4 C5 C6 C7 C8 C9 C10
R1: TCK GND GND 5V_U GND GND 3V3 GND GND TDI
R2: GND TMS GND GND USB+ USB- GND GND TTD_RETURN GND
| Pin | Signal | Direction | Description |
|---|---|---|---|
| C1R1 | TCK | JM → CTL | JTAG Clock (buffered via U2, 33Ω via R2) |
| C2R1 | GND | — | Ground |
| C3R1 | GND | — | Ground |
| C4R1 | 5V_USB | CTL → JM | 5V USB power (from CTL TPS2065C rail) |
| C5R1 | GND | — | Ground |
| C6R1 | GND | — | Ground |
| C7R1 | 3V3_ENIG | CTL → JM | 3.3V logic rail (JTAG signal reference) |
| C8R1 | GND | — | Ground |
| C9R1 | GND | — | Ground |
| C10R1 | TDI | JM → CTL | JTAG Data In (33Ω via R4, then R1 at FT232H) |
| C1R2 | GND | — | Ground |
| C2R2 | TMS | JM → CTL | JTAG Mode Select (buffered via U2, 33Ω via R3) |
| C3R2 | GND | — | Ground |
| C4R2 | GND | — | Ground |
| C5R2 | USB+ | Bidir | USB 2.0 D+ to CM5 |
| C6R2 | USB− | Bidir | USB 2.0 D− to CM5 |
| C7R2 | GND | — | Ground |
| C8R2 | GND | — | Ground |
| C9R2 | TTD_RETURN | CTL → JM | JTAG Data Out (return) |
| C10R2 | GND | — | Ground |
No external connectors: The JM has no external connectors. USB is entirely internal via J1 (DF40C-20 BtB connector). No USB-C connector exists on the JM. CC pins are irrelevant (USB 2.0 only).
See
design/Electronics/JTAG_Module/Board_Layout.mdfor connector placement and layout details (§3 J1 DF40 BtB Connector).
FT232H JTAG Signal Mapping (MPSSE Mode)
- AD0 → TCK (Clock)
- AD1 → TDI (Data In)
- AD2 → TDO (Data Out)
- AD3 → TMS (State Machine)
Voltage
3.3V logic level (VCCIO = 3V3_ENIG). FT232H VCC = 5V_USB. 5V-tolerant I/O.
GND_CHASSIS Single-Point Bond
Per design/Standards/Global_Routing_Spec.md §5, the JM is exempt from the local
GND_CHASSIS requirement because it is a board-mounted daughterboard that does not connect
directly to the enclosure. Its mounting holes / conductive standoffs therefore tie to GND
only, not to a standalone GND_CHASSIS net. The system's only galvanic GND ↔ GND_CHASSIS bond
remains on the Power Module at the common power-entry point immediately before the eFuse.
4. Aesthetics & Mounting
- Visibility: Completely hidden internally.
- Mounting: Small 4-layer PCB (DEC-017) mounted as a hat on the Controller Board via conductive
standoffs. As a non-chassis-connected daughterboard, its mounting holes tie to GND only.
The M2.5 standoffs used to attach the JM to the CTL are specified and sourced in the
Controller Board BOM (MH9–MH12, 9774035151R). See
design/Electronics/Controller/Design_Spec.md, DEC-057 (standoff ownership rule), and DEC-058 for the JM upgrade decision. Mounting hole positions (MH1–MH4) are defined relative to the JM board edge; final CTL board locations are deferred to PCB layout. Seedesign/Standards/Global_Routing_Spec.md §4for module mounting hole specification rules. - Data Plate: Per
design/Standards/Global_Routing_Spec.md §6on Layer L4, Revision Block text:PROGRAMMIERWERK [JTAG Module] V1.0.
5. PCB Fabrication & Stackup
Inverted 4-layer stackup per design/Standards/Global_Routing_Spec.md §2.3.2.
Physical properties: see design/Production/JLCPCB_Manufacturing.md §1.1. For JTAG CI trace width compliance, see Board_Layout.md §6.1.
6. Electrical Requirements
- Power Architecture:
- FT232H VCC = 5V_USB (5V) via J1 DF40 Pin C4R1 - from the Controller Board's TPS2065C-protected USB power rail (same current-limited rail as the USB 3.0 ports, 1.6A limit).
- FT232H VCCIO = 3V3_ENIG (3.3V) via J1 DF40 Pin C7R1 - sets JTAG signal voltage to match CPLD I/O logic levels (same role as CM5 GPIO reference voltage).
- FT232H VBUS pin tied to 5V_USB (always-on; USB connection to CM5 is internal - no VBUS monitoring needed).
- USB connection is entirely internal: D+ and D- travel from FT232H via J1 DF40 connector (C5R2/C6R2) through the Controller Board PCB directly to the CM5 USB 2.0 port. No USB-C connector on the JM.
- FT232H operates in self-powered USB mode - power from system (5V_USB), not from USB host.
- CM5 enumerates the FT232H when Linux boots and ftdi_sio loads; no JM-side power sequencing required.
- Controller TPS2065C is the upstream current limiter; no additional current limiter on JM.
- Bulk Capacitor Exception: The JM is exempt from the standard 5x bulk entry bank rule. The Controller Board upstream provides a fully-bypassed power rail. Per-IC decoupling per FT232H datasheet: C1-C4, C6-C9 = 8x 100nF (one per FT232H supply pin: VCCA, VCORE, VCCD, VCCIOx3, VPLL, VPHY) plus a single 4.7µF entry filter (C5) on 5V_USB.
- UART/MPSSE Mode-Switch Contention (Informational): The FT232H supports both UART and MPSSE modes.
During mode-switch transitions (e.g., when
ftdi_sioloads before OpenOCD re-opens the device in MPSSE mode), TX/RX lines briefly enter an undefined state. On the JM, FT232H UART lines (AD4/AD5) are not externally connected to the JTAG chain, so this does not affect normal operation. If future firmware exercises FT232H UART capability, the mode-switch sequence in FTDI Application Note AN_135 must be followed to prevent false characters or bus glitches. - FT232H REF Pin Biasing (DR-JM-21): R8 (12 kΩ ±1%, ERJ-2RKF1202X) connected from FT232H REF (pin 5) to GND. The REF pin sets the USB 2.0 High-Speed PHY internal bias reference current. A precise 12 kΩ ±1% resistor is required per FTDI FT232H datasheet §3.5 and Application Note AN_146. Without R8, the HS PHY cannot negotiate chirp and the device falls back to USB Full-Speed (12 Mbps) or fails to enumerate entirely.
- FT232H TEST Pin (DR-JM-22): FT232H TEST (pin 42) is tied directly to GND by a PCB copper trace.
No series component is placed. Per FTDI FT232H datasheet Table 3.2: TEST is a factory test pin that
must be connected to GND for normal operation. Leaving TEST floating enables internal factory test mode
and corrupts USB enumeration behaviour., ensuring the chip
remains deasserted (RESET_N HIGH = normal operation) at all times during normal use. RESET_N is active-low;
if left floating the pin may latch LOW and prevent the FT232H from operating. An external pull-up is
required per FTDI application note AN_108 when RESET_N is not driven by the host (see DR-JM-16).
RESET_Nis a board-local net name scoped to JM; it does not conflict with the system-levelCPLD_RESET_Nnet, which is driven by the Stator CPLD and distributed across inter-board connectors. Separate KiCAD projects are used per board, so these net names remain naturally isolated at capture time. - Clocking: Dedicated 12MHz SMD crystal (Y1) for the FT232H reference clock. The FT232H internal PLL requires 12MHz; CM5 GPCLK option was considered and rejected - see DEC-022. Note: package corrected from SMD-3225 to SMD-5032 per CTS 435 datasheet. KiCAD footprint adapted from the unofficial Crystal_SMD_5032-4Pin symbol in KiCAD 10.0; 3D model approximated from the 2-pin 5032 STEP. Crystal load capacitors C10-C11 (33pF C0G) set the 20pF crystal load capacitance. Load cap calculation: The crystal specifies C_L = 20pF. Two equal load caps in series give C_series = C/2; adding PCB stray capacitance (C_stray ≈ 3-4pF, from PCB traces and FT232H XTIN input capacitance) yields: C_L = C/2 + C_stray = 33/2 + 3.5 ≈ 16.5 + 3.5 = 20pF ✔ 33pF C0G is therefore the correct value. Do not change to 15pF (which would give C_L ≈ 7.5 + 3.5 = 11pF, far below spec).
- JTAG Signal Integrity:
- R1 (33Ω): Series termination on FT232H TDI output, placed within 2mm of the FT232H TDI pin.
TDI drives only the first CPLD in the chain (single load) - source termination at the FT232H pin
provides matched drive (FT232H output ≈ 20Ω + R1 33Ω ≈ 53Ω) for the board-to-board path.
Per DEC-016 intra-board/BtB termination rule. See
design/Electronics/JTAG_Module/JTAG_Integrity.md. - R4 (33Ω): Series damping on TDI signal (not buffered) before J1 (TDI pin, C10R1). Combined with R1 at FT232H, provides damping at both ends of the FT232H-to-J1 TDI path.
- U2 (SN74LVC2G125DCUR, VSSOP-8): Dual-channel 3-state buffer placed between the FT232H and J1 connector (JTAG OUTPUT side), buffering TCK and TMS for the 37-device JTAG chain load. TDI is not buffered - FT232H TDI drives only the first device in the chain directly. 1OE and 2OE (active-low output enables) are permanently tied to GND, keeping both buffer channels always enabled.
- R2 (33Ω): Series damping on U2 TCK output, placed within 2mm of the U2 output pin, before J1 DF40 connector (TCK pin, C1R1). Source impedance after U2: U2_out (≈15Ω) + R2 (33Ω) ≈ 48Ω - matched to 50Ω BtB trace impedance per DEC-024.
- R3 (33Ω): Series damping on U2 TMS output - same function as R2 (TCK). Placed before J1 (TMS pin, C2R2).
- Pull Resistors: TMS 10kΩ pull-up (R6) and TCK 10kΩ pull-down (R7) near J1 connector to hold JTAG TAP in defined state
when idle (see §5 and JTAG best-practice note in
design/Electronics/JTAG_Module/JTAG_Integrity.md). - Trace Width Rule: All JTAG signal traces on L2 (signal layer) shall be routed at the CI width specified in
design/Standards/Global_Routing_Spec.md §2.3.2(inner stripline), targeting 50 Ω controlled impedance.
- R1 (33Ω): Series termination on FT232H TDI output, placed within 2mm of the FT232H TDI pin.
TDI drives only the first CPLD in the chain (single load) - source termination at the FT232H pin
provides matched drive (FT232H output ≈ 20Ω + R1 33Ω ≈ 53Ω) for the board-to-board path.
Per DEC-016 intra-board/BtB termination rule. See
Signal Integrity note (JM as complete JTAG master): The JM hosts all JTAG buffering and termination for the system. U2 buffers TCK and TMS for the 37-device chain load. Series damping (R2-R4) at 33 Ω matches the BtB trace impedance (50 Ω) per DEC-016. The Controller
J12↔ StatorJ10logic dock is a direct board-to-board connection (no cable) - 33 Ω applies throughout (not the 75 Ω cable-driving rule). The Controller board routes JTAG lines as pass-through without active components. See DEC-024.
7. Thermal & ESD
- Thermal: Low-power debug board; no thermal management required.
- ESD: No TVS/ESD protection required — J1 (DF40C-20 BtB connector) is an internal board-to-board connector with no user access, per
design/Standards/Global_Routing_Spec.md §9.
8. Bill of Materials
| RefDes | Specification | MPN | Manufacturer | DigiKey PN | Mouser PN | JLCPCB PN | Alt Supplier + PN | Notes | Footprint Available | Footprint Downloaded | Qty |
|---|---|---|---|---|---|---|---|---|---|---|---|
| C1-C4, C6-C9, C12 | 100nF X7R 50V 0402 | CL05B104KB5NNNC | Samsung | 1276-CL05B104KB5NNNCCT-ND | 187-CL05B104KB5NNNC | C960916 | - | - | ✔ | ✔ | 9 |
| C5 | 4.7µF X7R 50V 1210 | CGA6P3X7R1H475K250AD | TDK | 445-10040-1-ND | 810-CGA6P3X7R1H475KD | C3877549 | - | - | ✔ | ✔ | 1 |
| C10-C11 | 33pF C0G/NP0 crystal load 0402 | C0402C330J5GAUTO | Kemet | 399-12979-1-ND | 80-C0402C330J5GAUTO | C2169327 | - | - | ✔ | ✔ | 2 |
| J1 | 20-pin 0.4mm pitch BtB plug (bottom-centre of board) | DF40C-20DP-0.4V(51) | Hirose | H11618CT-ND | 798-DF40C20DP0.4V51 | C424637 | - | see DR-JM-19, DEC-058; Mouser lists as DF40C-20DP-0.4V(51) — search by Mouser PN 798-DF40C20DP0.4V51 | ✔ | ✔ | 1 |
| R1-R4 | 33Ω 1% 0402 | ERJ-2RKF33R0X | Panasonic | P33.0LCT-ND | 667-ERJ-2RKF33R0X | C278594 | - | see DEC-016; see DEC-024 | ✔ | ✔ | 4 |
| R5-R7 | 10kΩ 1% 0402 | ERJ-2RKF1002X | Panasonic | P10.0KLCT-ND | 667-ERJ-2RKF1002X | C191123 | - | - | ✔ | ✔ | 3 |
| R8 | 12kΩ 1% 0402 | ERJ-2RKF1202X | Panasonic | P12.0KLCT-ND | 667-ERJ-2RKF1202X | C25741 | - | FT232H REF pin bias; see DR-JM-21; FTDI datasheet §3.5, AN_146 | ✔ | ✔ | 1 |
| U1 | USB 2.0 to MPSSE bridge LQFP-48 | FT232HL-REEL | FTDI Chip | 768-1101-1-ND | 895-FT232HL-REEL | C51997 | - | - | ✔ | ✔ | 1 |
| U2 | Dual 3-state buffer VSSOP-8 | SN74LVC2G125DCUR | Texas Instruments | 296-SN74LVC2G125DCURCT-ND | 595-SN74LVC2G125DCUR | C21404 | - | - | ✔ | ✔ | 1 |
| Y1 | 12MHz 20pF ±20ppm crystal SMD-5032 (5.0×3.2×1.1mm) | 435F12012IET | CTS | 110-435F12012IETTR-ND | 774-435F12012IET | C19766404 (Extended) | - | see DEC-022 | Yes* | Yes* | 1 |