Blind Buried Via PCB Manufacturing - nodsmt/NOD GitHub Wiki

In terms of circuit board industry from the late 20th century and early 21st century, the circuit boards in the electronics industry expediated in technology development and electronic assembly technology. Printed circuit board industry, only sync with development so as to continue to meet customer needs. Accompanied with small, light, thin of electronic products, subsequently flexible printed circuit boards, aburied/blind, rigid flex PCBs were innovated. buried via pcb When it comes to blind/buried vias, first of all, we speak from the traditional multilayer PCB. Standard structure of the multi-layer circuit boards contain inside and outside circuits, then realize productivity connection by drilling holes and metallization process. But due to increasing circuit density, components package constantly update. In order to place more high performance components onto limited board area, the circuit will be thinner and via dimeter shrink from DIP plug-hole diameter 1mm to SMD 0.6mm and further to 0.4mm. But it still takes up the area, which leads buried and blind via. Blind and buried vias are defined as follows: Blind Via Applied to connection of surface layer and one or more inside layers. The blind via locates on one side of PCB and then extend to inner layers. Buried Via The through hole between inside layers. After lamination, we can not see the holes, so they don’t occupy the outside layer area. Top and bottom layer of the blind through hole are located inside of the PCB. blind via pcb

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