Various Packages under Spartan 6 - muneeb-mbytes/FPGABoard_edgeSpartan6 GitHub Wiki

What are Packages?

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Packaging is a key tool in FPGA that provides the boundaries between Synthesis, Technology, Mapping and Placement. FPGA Package refers to how the FPGA pins are brought outside the FPGA, i.e. the packaging of the FPGA.

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Available Packages

Serial Number Package Name
1. CPG196
2. CSG225
3. CSG324
4. CSG484
5. FTG256
6. FGG484
7. FGG676
8. FGG900
9. TQG144

Features

1. CPG196

  • CPG196-Ceramic Pin Grid Array with 196 pins.

CQFP

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  • This package has 196-pin ceramic quad flat pack (CQFP) package.
  • Pitch (distance between adjacent pins) of 0.5mm
  • Has Package dimensions of 8x8mm.
  • Suitable for applications where higher reliability or higher operating temperatures are required.
  • Offers a more traditional packaging option compared to BGA packages.
  • Commonly used for FPGA families such as the Xilinx Virtex-6, Artix-7,Xilinx Zynq-7000,Spartan-6.

2. CSG225

  • CSG225-Chip-Scale Grid Array with 225 pins
  • The CSG225 package has 225-pin ceramic ball grid array (CBGA) package.
  • Pitch (distance between adjacent pins) of 0.8mm
  • Package dimensions of 13mm x 13mm.
  • Suitable for applications where higher reliability or higher operating temperatures are required.
  • Offers a more compact packaging option compared to larger CQFP packages.
  • Commonly used for FPGA families such as the Spartan-6 LX, Spartan-6 LXT,Spartan-6 FPGA.

3. CSG324

  • CSG324-Chip-Scale Grid Array with 324 pins
  • This package has 324 pins arranged in a grid
  • Pitch (distance between adjacent pins) of 0.8mm
  • Has package dimension of 15mm x 15mm
  • It is often used for medium to large sized devices
  • Provides a good balance between pin count, size, and cost
  • Commonly used for FPGA families such as the Xilinx Virtex-4, Virtex-5, and Spartan-6

4. CSG484

  • CSG484-Chip-Scale Grid Array with 484 pins
  • This package has 484 pins arranged in a grid
  • Pitch (distance between adjacent pins) of 0.8mm
  • Has package dimension of 19mm x 19mm
  • It is often used for larger devices than the CSG324 package
  • Provides a higher pin count for more complex designs
  • Commonly used for FPGA families such as the Xilinx Virtex-6, Virtex-7, Spartan-6 and Artix-7

5. FTG256

  • FTG256-Fine-Pitch Thin Grid Array with 256 pins.
  • This package has 256 pins arranged in a grid
  • Pitch (distance between center of adjacent pins) of 1.0mm
  • Package dimension of 17mm x 17mm
  • The FTG256 package is widely used in various applications that provides balance in pin count and small form factor, such as communications, networking, computing, and video processing.
  • Commonly used for FPGA families such as the Xilinx Virtex-4, Spartan-3,Spartan-6.

6. FGG484

  • FGG484-Fine-Pitch Ball Grid Array with 484 balls
  • This surface mountable package has 484 pins arranged in a grid
  • Pitch (distance between center of adjacent pins) of 1.0mm
  • Package Dimensions of 23mm x 23mm
  • The FGG484 package is compliant with the RoHS (Restriction of Hazardous Substances) directive, which means that it does not contain any hazardous substances that could harm the environment or human health
  • Used for the XC6SLX45 FPGA and Spartan-6.
  • The high pin count of the FGG484 package allows for a large number of I/Os and provides designers with the flexibility to implement a wide range of designs.

7. FGG676

  • FGG676-Fine-Pitch Ball Grid Array with 676 balls
  • The FGG676 package has 676 pins which is a grid array package.
  • The pin pitch (distance between adjacent pins) for this package is typically 1.0 mm.
  • Has package dimension of 27mm x 27mm.
  • It is used for both smaller and larger FPGA devices.
  • Provides a high pin count for complex FPGA designs
  • It is used by Xilinx for some of its Virtex-6 FPGA devices and spartan-6.

8. FBG900

  • FBG900-Fine-Pitch Ball Grid Array with 900 balls
  • The FBG900 package has 900 pins which is a ball grid array (BGA) package used with the Xilinx Spartan-6 FPGA family.
  • Pitch (distance between adjacent pins) of 1.0mm
  • Has package dimension of 31mm x 31mm.
  • The package provides a high pin count and high I/O bandwidth.
  • Commonly used for FPGA families such as the Xilinx Virtex-7,Xilinx Zynq-7000,spatan-6.

9. TQG144

  • TQG144-Thin Quad Flat no-lead Pack with 144 pins

  • QFN Package

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  • cross sectional view of QFN Package

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  • This package refers to quad flat no-lead (QFN) package with 144 pins.
  • A cross-section of a QFN package would typically show the semiconductor chip inside the package, with wire bonds connecting the chip to the pads on the bottom of the package.
  • The cross-section may also show a layer of solder paste between the pads on the bottom of the package and the PCB, which is melted during the soldering process to create a permanent connection.
  • Pitch (distance between the centers of adjacent pins) is 0.5mm.
  • The package has a square shape with dimensions of approximately 22mm x 22mm.
  • It is often used for small to large sized devices.
  • It provides a good balance between pin count, size and cost.
  • The TQG144 package is used for several members of the Xilinx Spartan-6 FPGA family, including the XC6SLX25, XC6SLX45, XC6SLX75, and XC6SLX100.