Introduction

What are packages in FPGA?

FPGA Package refers to how the FPGA pins are brought outside the FPGA, i.e, the packaging of the FPGA.

Pitch in FPGA packaging

Pitch in FPGA packaging refers to the distance between the center of one pin to the center of the adjacent pin. The pitch of an FPGA package determines the size of the package and the number of pins that can be accommodated in a given area.

The pitch of the package affects the size and number of pins, which in turn affects the performance and functionality of the FPGA.

Package dimensions

• Package dimension in Spartan-6 FPGA refers to the physical size of the package
• It determines the amount of space required for the FPGA on the board
• Package dimensions in Spartan-6 FPGA are typically measured in inches or millimeters
• The dimensions are usually specified in the datasheets provided by Xilinx and other manufacturers ( for example tqg144 has a dimension of 22mm x 22mm)

Weight of FPGA package

The weight of the package is an important factor to consider when designing a circuit board, as it affects the overall weight of the board and the components. The weight of the package is typically measured using a precision scale or balance to ensure accuracy.

• The average weight of TQG144 package is about 1.275 g (https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/pk746_tqg144.pdf)

Pb-free Packaging

Xilinx offers lead-free devices (Pb-free) that comply with the European Union’s RoHS directive.

The goal of RoHS (Reduction of Hazardous Substances) is to reduce the environmental effect and health impact of electronics. The legislation's primary purpose is to make electronics manufacturing safer at every stage of an electronic device's life cycle.

The RoHS Directive currently restricts the use of ten substances: lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), bis(2-ethylhexyl) phthalate (DEHP), butyl benzyl phthalate (BBP), dibutyl phthalate (DBP) and diisobutyl phthalate (DIBP).

The Pb-free packages include an extra G in the package code. For example, FTG256 is the Pb-free version of the FT256 package. When referenced together, the G is incorporated as FT(G)256. The Pb and Pb-free packages are identical in pin-out, size, and thermal characteristics.

Packaging used in Spartan 6

Sl No	Package Type
1	Quad flat package (QFP)
2	Chip scale BGA package (CSBGA)
3	Ceramic pin grid array (CPGA)
4	Fine-Pitch Thin BGA package (FTBGA)
5	Flip-Chip Ball Grid Array (FCBGA)

Spartan 6 FPGA package device pinout files