Electronics Redesign Requirements - jrsteensen/OpenHornet GitHub Wiki
Electronics Redesign Requirements
General Requirements
All SMD Components should be on one side of PCB to facilitate ordering PCBs pre-fabbed.
Utilize JLCPCB SMD components wherever possible to facilitate fabrication.
Utilize LCSC through-hole (PTH) components as they ship with JLCPCB.
Power and bus connectors should be placed on opposing sides of PCB to allow under-console “flow” of cables horizontally without additional stresses, with the option of utilizing.
Remove bus terminator resistor positions from PCBs. Operators can simply replace the connector at the end of the bus with the resistor.
Remove 12V transistors from PCBs. Can specify a COTS replacement.
Utilize common SMD PCB components as specified in Table 1 wherever possible.
Utilize common PTH PCB components as specified in Table 2 wherever possible.
Utilize existing PCB footprints for unique PCBs wherever possible to minimize mechanical redesign.
Utilize tactile switches instead of dome switches throughout pit.
Utilize Arduino and DCS-BIOS control stack.
Utilize test points as required on PCB.
Input electrical requirement: 120AC @ 60hz.
Inputs
Utilize 10k pullup resistors on all digital inputs.
Cockpit Backlighting System
Utilize ABSIS Backlighting Bus.
Common Connectors/Buses
ABSIS Power-In Bus
Type: PWR
Purpose: This bus is used for supplying power from PSU to the Mega Masters & Backlighting Controller.
All PCBs shall be 2 layer max, except UFC which may be 4-6 layer max.
Bypass Caps
When in doubt, give each IC power pin a 0.1 µF ceramic cap, preferably size 0805 or smaller, in parallel with a 10 µF polarized tantalum or ceramic. You can probably omit the 10 µF cap, or replace it with something smaller, if you are concerned only about high-frequency noise.
If you need to compensate for long-term supply deviations that will require large amounts of stored charge, you may need to give each IC an additional larger capacitor, say 47 µF.
Locate the high-frequency ceramic caps as close to the power pin as possible, and use short traces and vias to minimize parasitic inductance and resistance. (within .3" of power pin.) The location of larger capacitors intended for low-frequency bypassing is not quite as critical, but these also should be close to the IC—within a half-inch or so.
Arduino Based Simulator Interface System (ABSIS) Requirements
ABSIS Nano
Controller: Arduino Nano
Comm In: RS485 Slave (TX/RX0)
Comm Out: N/A
Power: ABSIS PWR Bus
Library: As required for components.
Function: Breaks out Nano I/O for easy wiring of pit. 12V I/O Accessory boards may be wired to digital outputs to support 12V components (solenoids, etc.) Requires jumper/DIP Switch to support disabling RS485/enabling USB for programming purposes.
ABSIS Mega
Controller: Arduino Mega
Comm In: RS485 Slave (TX/RX0)
Comm Out: N/A
Power: ABSIS PWR Bus
Library: As required for components.
Function: Breaks out Mega I/O for easy wiring of pit. 12V I/O Accessory boards may be wired to digital outputs to support 12V components (solenoids, gauge servos/steppers, etc.) Requires jumper/DIP Switch to support disabling RS485/enabling USB for programming purposes.
ABSIS RS485 Bus Master (Mega)
Controller: Arduino Mega
Comm In: USB
Comm Out1: RS485 Master (D2/TX1/RX1)
Comm Out2: RS485 Master (D3/TX2/RX2)
Comm Out3: RS485 Master (D4/TX3/RX3)
Power: ABSIS PWR Bus (Vin: 12V)
Library: As required for components.
Function: Breaks out Mega I/O for easy wiring of pit. 12V I/O Accessory boards may be wired to digital outputs to support 12V components (solenoids, gauge servos/steppers, etc.) Requires jumper/DIP Switch to support disabling RS485/enabling USB for programming purposes.
ABSIS Backlighting Controller
Controller: Arduino Mega
Comm In: USB
Comm Out: ABSIS Backlighting Bus
Power: ABSIS PWR Bus
Library: FastLED
Function: Breaks out all PWM pins to standard ABSIS Backlight Bus. Utilizes direct PC comms via USB at the top level, runs Backlighting Bus to each console.