Footprint specifications

General Naming conventions

Generic part naming

Generic and reusable footprints shall use the following syntax

[Part use]-[Package Type]-[Pin count if applicable]-[Legnth in mm]-[Width in mm]-[Height in mm (optional)]

• IC-LQFP-32-7mmX7mm

Vendor-specific footprints

Parts that are specific to a particular vendor and do not have any alternatives shall use the following syntax

[Part use]-[Special features if applicable]-[Mounting technology]-[Color if applicable]-[Vendor/Manufacturer]-[Series if applicable]-[Manufacturer Part Number]

• Fuse-Current-PTC-Littelfuse-290l185DR
• Connector-Header-5pos-PTH-Green-Phoenix-Mini-Combicon-1844249

IC Components

Positioning

All ICs shall be positioned with pin number 1 in the top left. The footprint shall be centered at the 0,0 point.

Silkscreen

Variable Pin Names

Some parts may have pins that are multi-use. Each symbol shall have Field Names for those designated pins in the schematic symbol. They shall be referenced in the footprints. PTH parts shall have it exposed on both sides of the board by default.

Pin 1 Designation

Each IC shall have a way of designation pin 1 of the package.

• The pad shall have rounded corners
• There shall be a silkscreen circle to the side.
  • SMD Packages
    • The circle shall have a radius of 0.1mm
    • The circle shall have a line thickness of 0.2mm
  • PTH Packages
    • The circle shall have a radius of 0.2mm
    • The circle shall have a line thickness of 0.4mm